The Application of Phase Diagram for Interfacial Reactions in Electronic Packaging - Crimson Publishers

The Application of Phase Diagram for Interfacial Reactions in Electronic Packaging by Yee Wen Yen* in Crimson Publishers: Peer Reviewed Material Science Journals


The phase diagram investigation is basically scientific study of materials science and engineering. The basic materials knowledge, such as material thermodynamics and kinetic, phase transformation, and solid state diffusion can be used to explain the intermetallic compounds (IMCs) formed at the interface. Meanwhile, the phase diagram information is one of the important tools, as well. The phenomena in the interfacial reaction should be combined with the phase equilibrium information. Therefore, we can have a clear understanding of the interfacial reaction between the atomic diffusion mechanism and the final equilibrium condition. In the electronic packaging process, lead-free solders are Sn-based alloys, and the substrate is likely to be the Ni/Cu structure. During the soldering process, both Cu and Ni are rapidly dissolved into the molten solder, resulting in the concentration changes of Cu or Ni.


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